Room Temperature Wafer Bonding Device BOND MEISTER【Semiconductor Manufacturing】
A room temperature wafer bonding device that opens new horizons in the bonding process. Supporting device development with high reliability, bonding quality, and bonding support services!
Joining is performed by activating the surface of the joining materials with an ion beam in a vacuum. ■Application in MEMS wafer-level packaging - Packaging can be done at the wafer level before dicing, simplifying subsequent processes. - Since no heating is involved, thermal distortion is eliminated even for fine structures. - Increased productivity as there is no need for heating and cooling time. - Ideal for the development of stacked high-integration MEMS. ■Application to other high-functionality devices - Capable of joining a wide range of materials such as metals, quartz, sapphire, and oxide single crystals. - High yield is achievable due to the absence of thermal distortion. - Dissimilar materials can also be joined at room temperature, enabling previously impossible joints and enhancing design flexibility for devices. A lineup of equipment that maximizes the benefits of the room temperature joining process (all-in-one setup including alignment equipment, wafer transport robots, and bonding mechanisms). For more details, please contact us or download the 'catalog' for confirmation.
- Company：ニデックマシンツール（前：日本電産マシンツール） 本社・本工場
- Price：Other
